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March 2017

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 7 Mar 2017 20:25:39 +0000
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That is all covered in the Design Standard, IPC-D-279, Section 3.3.9 "Component Spacing", Section 8.0 "Design for Testability", and the section on Design for Reworkability.

It's all there. Just $80 from your beautiful local IPC Sales Representative, and no self-respecting Electronics Design or Electronics Manufacturing Engineer should be caught without a current copy. You may wish to keep a copy in the fiskhytte as well for those slow times.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Iulia Muntele

Sent: Tuesday, March 07, 2017 2:07 PM

To: [log in to unmask]

Subject: Re: [TN] BGA periphery keep out zone



None that I can think off. There should not be any limitations at placement, maybe at rework and inspection.



On Tue, Mar 7, 2017 at 2:04 PM, <[log in to unmask]> wrote:



> Fellow TechNetters:

>

>     Which IPC Standard cover the above stated limits for components 

> placement on the periphery of a BGA foot print?

>

> Victor,

>



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