a handheld XRF may work faster with no need for material removal
On Tue, Mar 7, 2017 at 12:52 PM, Nutting, Phil <[log in to unmask]>
wrote:
> I’ll have to see if we have an SEM. It is very possible this pot had
> SAC305 in it. I can tell you it killed a carbide drill bit.
>
> From: David Hillman [mailto:[log in to unmask]]
> Sent: Tuesday, March 07, 2017 1:50 PM
> To: TechNet E-Mail Forum; Nutting, Phil
> Subject: Re: [TN] grunge at bottom of tinning solder pot
>
> Hi Phil - what you have is an IMC which is more dense that solder so it
> sank to the bottom. It may be FeSn which is pretty tough to remove. Use
> the SEM to figure out what IMC you have and then it may be possible to
> dissolve it with another solder alloy (i.e. SAC305, etc.).
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]<mailto:[log in to unmask]
> >
>
> On Tue, Mar 7, 2017 at 12:12 PM, Nutting, Phil <[log in to unmask]
> <mailto:[log in to unmask]>> wrote:
> I have two wire tinning solder pots that have not received the proper
> day-to-day maintenance and now there is solid crud filling all but about ¼
> of the crucible. I have tried chiseling it out and drilling it out. All I
> end up with is dull tools, even carbide drills.
>
> Other than buying new solder pots or replacing the crucibles are there any
> suggestions for removing this super hard stuff?
>
> Phil Nutting | HVP Development Engineer | Excelitas Technologies Corp
>
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> [log in to unmask]>>
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