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| Date: | Tue, 7 Mar 2017 12:50:14 -0600 |
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Hi Phil - what you have is an IMC which is more dense that solder so it
sank to the bottom. It may be FeSn which is pretty tough to remove. Use
the SEM to figure out what IMC you have and then it may be possible to
dissolve it with another solder alloy (i.e. SAC305, etc.).
Dave Hillman
Rockwell Collins
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On Tue, Mar 7, 2017 at 12:12 PM, Nutting, Phil <[log in to unmask]>
wrote:
> I have two wire tinning solder pots that have not received the proper
> day-to-day maintenance and now there is solid crud filling all but about ΒΌ
> of the crucible. I have tried chiseling it out and drilling it out. All I
> end up with is dull tools, even carbide drills.
>
> Other than buying new solder pots or replacing the crucibles are there any
> suggestions for removing this super hard stuff?
>
> Phil Nutting | HVP Development Engineer | Excelitas Technologies Corp
>
> Lab: +1 978.224.4332 | Office: +1 978.224.4152
> 35 Congress St, Salem, MA 01970 USA
> [log in to unmask]<mailto:[log in to unmask]>
> www.excelitas.com<http://www.excelitas.com/>
>
>
> [Excelitas R_emailsig]
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