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March 2017

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From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 30 Mar 2017 14:08:08 -0400
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is that pcb007 just got a layout guideline for high speed?
> Hi all,
>
> Are there any standards or guidelines for how PCBs are laid out when
> dealing with small components in one area and large thermal mass
> components and ground planes in another area and being successful in wave
> soldering or reflow?
>
> Phil Nutting  |  HVP Development Engineer   |  Excelitas Technologies Corp
>
> Lab: +1 978.224.4332   |  Office: +1 978.224.4152
> 35 Congress St, Salem, MA  01970 USA
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> www.excelitas.com<http://www.excelitas.com/>
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