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March 2017

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Subject:
From:
"Nutting, Phil" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nutting, Phil
Date:
Thu, 30 Mar 2017 17:56:58 +0000
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Hi all,

Are there any standards or guidelines for how PCBs are laid out when dealing with small components in one area and large thermal mass components and ground planes in another area and being successful in wave soldering or reflow?

Phil Nutting  |  HVP Development Engineer   |  Excelitas Technologies Corp

Lab: +1 978.224.4332   |  Office: +1 978.224.4152
35 Congress St, Salem, MA  01970 USA
[log in to unmask]<mailto:[log in to unmask]>
www.excelitas.com<http://www.excelitas.com/>


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