Dick,



Solder where it's not supposed to be should be considered contamination and whether or not it affects form, fit, or function isn't always clear on an assembly or drawing - you probably need to know how the surface will be used.



I like to see criteria on the drawing stating what is allowed, or to define any critical regions (i.e. contact areas) that may be restricted from solder splashes.



Ben



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Krug

Sent: Tuesday, March 21, 2017 1:36 PM

To: [log in to unmask]

Subject: EXTERNAL: [TN] Solder "Splash" on ENIG Gold - Is this a defect?



We occasionally get solder "splash" on exposed ground plane areas with an ENIG finish.  The "splash" is occasionally really splash from a selective wave process.  More frequently solder fines from solder paste, either from reflow spatter or from tooling / gloved hand transfer is the source of "splash".   "Splash" sites are typically no larger than ~0.5mm diameter.  



Are these defects per J-STD-001, class 3,  or IPC-A-610, class 3?  



Dick Krug, CSSBB, CSMTPE

Lead Process Engineer

Sparton Brooksville, LLC

30167 Power Line Road

Brooksville, FL  34602-8299

(352) 540-4012

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