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March 2017

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Subject:
Solder "Splash" on ENIG Gold - Is this a defect?
From:
Richard Krug <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Krug <[log in to unmask]>
Date:
Tue, 21 Mar 2017 17:35:54 +0000
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We occasionally get solder "splash" on exposed ground plane areas with an ENIG finish.  The "splash" is occasionally really splash from a selective wave process.  More frequently solder fines from solder paste, either from reflow spatter or from tooling / gloved hand transfer is the source of "splash".   "Splash" sites are typically no larger than ~0.5mm diameter.  



Are these defects per J-STD-001, class 3,  or IPC-A-610, class 3?  



Dick Krug, CSSBB, CSMTPE

Lead Process Engineer

Sparton Brooksville, LLC

30167 Power Line Road

Brooksville, FL  34602-8299

(352) 540-4012

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