Subject: | |
From: | |
Reply To: | |
Date: | Thu, 30 Mar 2017 20:29:46 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Look in the IPC Design Guidelines in IPC-D-279. While it has not been updated for awhile, it does have a lot of good information. Also IPC 6012 and 2222, etc., all have good info on the subject. I'm sure others will chime in.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nutting, Phil
Sent: Thursday, March 30, 2017 12:57 PM
To: [log in to unmask]
Subject: [TN] circuit board layout optimization for manufacturing
Hi all,
Are there any standards or guidelines for how PCBs are laid out when dealing with small components in one area and large thermal mass components and ground planes in another area and being successful in wave soldering or reflow?
Phil Nutting | HVP Development Engineer | Excelitas Technologies Corp
Lab: +1 978.224.4332 | Office: +1 978.224.4152
35 Congress St, Salem, MA 01970 USA
[log in to unmask]<mailto:[log in to unmask]>
www.excelitas.com<http://www.excelitas.com/>
[Excelitas R_emailsig]
Please consider the environment before printing this e-mail.
________________________________
This email message and any attachments are confidential and proprietary to Excelitas Technologies Corp. If you are not the intended recipient of this message, please inform the sender by replying to this email or sending a message to the sender and destroy the message and any attachments. Thank you.
|
|
|