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March 2017

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From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Thu, 30 Mar 2017 18:07:21 +0000
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Yup. Do it every day. 

Essential tools are:
Reflow: Good prediction software and lots of patience
Wave: X-ray with oblique viewing.

Do brush up on hole fill requirements for thru-hole. Rev F changed it a little.

Ed Popielarski
Engineering Manager


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nutting, Phil
Sent: Thursday, March 30, 2017 10:57 AM
To: [log in to unmask]
Subject: [TN] circuit board layout optimization for manufacturing

Hi all,

Are there any standards or guidelines for how PCBs are laid out when dealing with small components in one area and large thermal mass components and ground planes in another area and being successful in wave soldering or reflow?

Phil Nutting  |  HVP Development Engineer   |  Excelitas Technologies Corp

Lab: +1 978.224.4332   |  Office: +1 978.224.4152
35 Congress St, Salem, MA  01970 USA
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www.excelitas.com<http://www.excelitas.com/>


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