I also wonder if you pour liquid nitrogen over it, if the top layer may
'pop off' due to mismatch...
On Tue, Mar 7, 2017 at 12:55 PM, Iulia Muntele <[log in to unmask]>
wrote:
> a handheld XRF may work faster with no need for material removal
>
> On Tue, Mar 7, 2017 at 12:52 PM, Nutting, Phil <[log in to unmask]
> > wrote:
>
>> I’ll have to see if we have an SEM. It is very possible this pot had
>> SAC305 in it. I can tell you it killed a carbide drill bit.
>>
>> From: David Hillman [mailto:[log in to unmask]]
>> Sent: Tuesday, March 07, 2017 1:50 PM
>> To: TechNet E-Mail Forum; Nutting, Phil
>> Subject: Re: [TN] grunge at bottom of tinning solder pot
>>
>> Hi Phil - what you have is an IMC which is more dense that solder so it
>> sank to the bottom. It may be FeSn which is pretty tough to remove. Use
>> the SEM to figure out what IMC you have and then it may be possible to
>> dissolve it with another solder alloy (i.e. SAC305, etc.).
>>
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]<mailto:david.hillman@rockw
>> ellcollins.com>
>>
>> On Tue, Mar 7, 2017 at 12:12 PM, Nutting, Phil <
>> [log in to unmask]<mailto:[log in to unmask]>> wrote:
>> I have two wire tinning solder pots that have not received the proper
>> day-to-day maintenance and now there is solid crud filling all but about ¼
>> of the crucible. I have tried chiseling it out and drilling it out. All I
>> end up with is dull tools, even carbide drills.
>>
>> Other than buying new solder pots or replacing the crucibles are there
>> any suggestions for removing this super hard stuff?
>>
>> Phil Nutting | HVP Development Engineer | Excelitas Technologies Corp
>>
>> Lab: +1 978.224.4332<tel:%2B1%20978.224.4332> | Office: +1
>> 978.224.4152<tel:%2B1%20978.224.4152>
>> 35 Congress St, Salem, MA 01970 USA
>> [log in to unmask]<mailto:[log in to unmask]<mailto:
>> [log in to unmask]>>
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>>
>>
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