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Date: | Wed, 22 Mar 2017 20:54:26 +0000 |
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Dick,
Solder where it's not supposed to be should be considered contamination and whether or not it affects form, fit, or function isn't always clear on an assembly or drawing - you probably need to know how the surface will be used.
I like to see criteria on the drawing stating what is allowed, or to define any critical regions (i.e. contact areas) that may be restricted from solder splashes.
Ben
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Krug
Sent: Tuesday, March 21, 2017 1:36 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Solder "Splash" on ENIG Gold - Is this a defect?
We occasionally get solder "splash" on exposed ground plane areas with an ENIG finish. The "splash" is occasionally really splash from a selective wave process. More frequently solder fines from solder paste, either from reflow spatter or from tooling / gloved hand transfer is the source of "splash". "Splash" sites are typically no larger than ~0.5mm diameter.
Are these defects per J-STD-001, class 3, or IPC-A-610, class 3?
Dick Krug, CSSBB, CSMTPE
Lead Process Engineer
Sparton Brooksville, LLC
30167 Power Line Road
Brooksville, FLĀ 34602-8299
(352) 540-4012
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