We occasionally get solder "splash" on exposed ground plane areas with an ENIG finish. The "splash" is occasionally really splash from a selective wave process. More frequently solder fines from solder paste, either from reflow spatter or from tooling / gloved hand transfer is the source of "splash". "Splash" sites are typically no larger than ~0.5mm diameter.
Are these defects per J-STD-001, class 3, or IPC-A-610, class 3?
Dick Krug, CSSBB, CSMTPE
Lead Process Engineer
Sparton Brooksville, LLC
30167 Power Line Road
Brooksville, FLĀ 34602-8299
(352) 540-4012
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