No problem.

For a list of the properties that could be affected, I would simply start by looking at all of those properties listed within the IPC 4101 slash sheets and go from there.

In addition, I know there is an IPC specification for prepreg laminate materials as well, but I am not overly familiar with it, I just know it is out there. There may be additional properties listed within that document.

Please be aware also of the UL and fire-resistance properties which may not be so obvious in 4101. You would also need to look at compatibility of glass fillers with other common PCB fab materials and chemicals, especially dicy, bromides, etc.

I am sure you have some good and compelling reasons to investigate the use of resin fillers and if there is anything I can do to help with that please don’t hesitate to ask.





From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Tuesday, February 28, 2017 8:41 AM

To: [log in to unmask]; Stadem, Richard D.

Cc: [log in to unmask]

Subject: RE: [TN] LF Laminates, Resin Fillers



Dell - Internal Use - Confidential

Richard,



   Thank you very much for sharing your comments.   These were some of my concerns too.   I just wanted someone else to echo these concerns.....   I always ask for the round robin data to validate the process....   and proceed with extreme caution as you stated.….



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.

Sent: Tuesday, February 28, 2017 8:21 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] LF Laminates, Resin Fillers



While it is possible that some level of cabosil or other ground silica filler product may be added to the prepreg resin, I would be very, very careful of going down that path. Once again, you do not get something for nothing. Extensive qualification would be required for such a change. The insulative, dielectric, thermal expansion (CTE), thermal radiation, and many other properties would see a radical change if the laminate resin properties changed. Issues such as the ability to be drilled, drill wear, router wear, the ability for drilled holes to be plated through (bond strength of plated copper to the hole wall, moisture absorption (or lack thereof), glass transition (Tg) and damage point (Td) temperatures, resistance to CAF formation, flux entrapment, thermal dissipation properties, solder mask bonding, clad copper foil bonding strength, there are so many that would need to be qualified and studied. Is there a compelling reason you would want to do this? I'm not saying it is a bad idea, I am just saying proceed with extreme caution.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]<mailto:[log in to unmask]>

Sent: Tuesday, February 28, 2017 8:07 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: [TN] LF Laminates, Resin Fillers



Dell - Internal Use - Confidential



Bhanu,



    Thank you for sharing.....   I hope that other forum gurus will chime in on my laminate resin inquiry.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bhanu Sood

Sent: Monday, February 27, 2017 1:57 PM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] LF Laminates, Resin Fillers



No.

For a resin matrix used in e-glass reinforced laminates (e.g. FR4), adding spherical glass fillers creates too many opportunities for reliability and quality issues.





On Mon, Feb 27, 2017 at 9:50 AM, <[log in to unmask]<mailto:[log in to unmask]>> wrote:



> Fellow TechNetters:

>

>    Can the laminate resin incorporate round/sphere glass media filler?

>

> Victor,

>







--

Bhanu Sood

Tel: (202) 468-8449