While it is possible that some level of cabosil or other ground silica filler product may be added to the prepreg resin, I would be very, very careful of going down that path. Once again, you do not get something for nothing. Extensive qualification would be required for such a change. The insulative, dielectric, thermal expansion (CTE), thermal radiation, and many other properties would see a radical change if the laminate resin properties changed. Issues such as the ability to be drilled, drill wear, router wear, the ability for drilled holes to be plated through (bond strength of plated copper to the hole wall, moisture absorption (or lack thereof), glass transition (Tg) and damage point (Td) temperatures, resistance to CAF formation, flux entrapment, thermal dissipation properties, solder mask bonding, clad copper foil bonding strength, there are so many that would need to be qualified and studied. Is there a compelling reason you would want to do this? I'm not saying it is a bad idea, I am just saying proceed with extreme caution.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, February 28, 2017 8:07 AM
To: [log in to unmask]
Subject: [TN] LF Laminates, Resin Fillers
Dell - Internal Use - Confidential
Bhanu,
Thank you for sharing..... I hope that other forum gurus will chime in on my laminate resin inquiry.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bhanu Sood
Sent: Monday, February 27, 2017 1:57 PM
To: [log in to unmask]
Subject: Re: [TN] LF Laminates, Resin Fillers
No.
For a resin matrix used in e-glass reinforced laminates (e.g. FR4), adding spherical glass fillers creates too many opportunities for reliability and quality issues.
On Mon, Feb 27, 2017 at 9:50 AM, <[log in to unmask]> wrote:
> Fellow TechNetters:
>
> Can the laminate resin incorporate round/sphere glass media filler?
>
> Victor,
>
--
Bhanu Sood
Tel: (202) 468-8449
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