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Subject:
From:
Douglas Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Douglas Pauls <[log in to unmask]>
Date:
Thu, 16 Feb 2017 14:12:43 -0800
Content-Type:
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text/plain (76 lines)
That's a half-alloy.....


Doug Pauls
Principal Materials and Process Engineer
Rockwell Collins

On Thu, Feb 16, 2017 at 1:57 PM, Ed Popielarski <[log in to unmask]>
wrote:

> A new half-fractional element is used: bismuth nickel
>
> Ed Popielarski
> Engineering Manager
>
>
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> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
> Sent: Thursday, February 16, 2017 1:25 PM
> To: [log in to unmask]
> Subject: Re: [TN] New Solder Alloy
>
> No news with the elements tested...180 deg C is fine, reliability issues
> should be followed in years to come / aging tests
>
> On Tue, Feb 14, 2017 at 7:19 PM, Vargas, Stephen M <
> [log in to unmask]> wrote:
>
> > Got news of this from a colleague. Interesting... would love to hear
> > comments from the TechNet group.
> >
> > http://news.lenovo.com/news-releases/lenovo-announces-
> > breakthrough-innovative-pc-manufacturing-process.htm
> >
> > Regards,
> > Steve Vargas
> >
>
>
>
> --
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