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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 14 Feb 2017 18:34:28 -0700
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What, planned obsolescence? Never heard of such a thing! :-)


Steve Gregory

On Feb 14, 2017 5:30 PM, "Wayne Thayer" <[log in to unmask]> wrote:

> Another concern with an alloy with a designed reflow oven temperature of
> 180C is that the melting point is going to be around 145C. As devices run
> hotter and hotter, being so close to the melting point may decrease fatigue
> life significantly. Maybe Lenovo has defined the parameters for the
> attachment process and told the designers what the new boundary conditions
> are--for example, if fatigue life goes down due to the new alloy, bring it
> back up to acceptable by decreasing max operating temperature, reducing max
> component size, etc. Or maybe they figured out their products are lasting
> too long anyway!
>
> Wayne
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
> Sent: Tuesday, February 14, 2017 4:02 PM
> To: [log in to unmask]
> Subject: Re: [TN] New Solder Alloy
>
> Hi TechNet - I will echo Andy's comments, the SnBi solder alloy system may
> have some application in some products but a number of solder alloys in the
> SnBi alloy family have been extensively investigated and found to not be
> applicable for a large segment of high performance product types/use
> environments.
>
> Dave
>
> On Tue, Feb 14, 2017 at 2:06 PM, Giamis, Andy <[log in to unmask]>
> wrote:
>
> > Interesting.
> > I tore apart a certain smart phone a few years back and saw that they
> > attach heat shields/heat spreaders to the PCB edge with Sn-Bi.   The PCBA
> > was amazing but I thought the Sn-Bi solder joints had wetting issues
> > and many of the solder joints were cracked.  Sn-Bi seems to be rather
> brittle.
> > It would be interesting to see how this particular alloy performs.
> >
> >
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Buetow
> > Sent: Tuesday, February 14, 2017 11:38 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] New Solder Alloy
> >
> > I have been in touch with Lenovo about the alloy, which is a
> > tin-bismuth alloy developed in concert with Alpha and Senju. There's
> > some info in the link below based on what I've learned.
> > http://circuitsassembly.com/ca/editorial/menu-news/27004-
> > new-lenovo-lts-lowers-melting-temp-cuts-co2-emissions.html
> > Best,
> > Mike
> > -------- Original message --------From: "Vargas, Stephen M" <
> > [log in to unmask]> Date: 2/14/17  9:19 AM  (GMT-08:00) To:
> > [log in to unmask] Subject: [TN] New Solder Alloy Got news of this from a
> > colleague. Interesting... would love to hear comments from the TechNet
> > group.
> >
> > http://news.lenovo.com/news-releases/lenovo-announces-
> > breakthrough-innovative-pc-manufacturing-process.htm
> >
> > Regards,
> > Steve Vargas
> >
>

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