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January 2017

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Wed, 4 Jan 2017 12:35:33 +0000
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Dell - Internal Use - Confidential



David,



   Can I distinguish the tin plating process by SEM/EDX analysis.   Perhaps by an element different in the processes.



   I have also asked about the process difference between ENIG, P elements, and HARD GOLD plating, non P element, process when the XRF values are below 10 micro inches of gold.   The 10 micro inches value thickness is found in ENIG and hard gold plating process.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman

Sent: Tuesday, January 03, 2017 4:32 PM

To: [log in to unmask]

Subject: Re: [TN] Tin plating Process



Hi Victor - nope and if someone tells you they can, I would suggest walking away very quickly. A number of the industry committees have chased this question in terms of grain size, chemistry, carbon content, etc. and have come away very unsatisfied with the results. The best way to understand a bright acid tin versus a matte tin plating deposit is to team with the component supplier/plater to understand the deposition characteristics of the bath.



Dave Hillman

Rockwell Collins

[log in to unmask]<mailto:[log in to unmask]>





On Tue, Jan 3, 2017 at 3:06 PM, <[log in to unmask]<mailto:[log in to unmask]>> wrote:



> Fellow TechNetters:

>

>     Can I VISUALLY tell the difference between tin plating process,

> bright and matte tin?

>

> Victor,

>




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