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Date: | Wed, 18 Jan 2017 12:38:42 -0500 |
Content-Type: | text/plain |
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you mean this? you have to go to your device MFG to get the accurate info...
https://www.cirrus.com/en/pubs/appNote/AN315REV1.pdf
> Fellow TechNetters:
>
> Perhaps the third time is the charm:
>
> Is there any data out there regarding the integrity of a Thermal Header
> Solder Attachment/Bottom Termination Component solder joint integrity
> over time. Most BTC that I have x-rayed exhibit some degree of
> voiding. Can the solder joint voiding degrade the solder connection
> to a point that it would result in a shorted device internally due to
> heat build. Is a solder joint a considered a Thermal Insulator?
>
> Victor,
>
> From: Hernandez, Victor G
> Sent: Monday, January 16, 2017 3:15 PM
> To: TechNet E-Mail Forum <[log in to unmask]>
> Cc: Hernandez, Victor G <[log in to unmask]>
> Subject: FW: IPC Standard, Thermal Header Solder Attachment Devices, or
> Bottom Termination Components
>
> Fellow TechNetters:
>
> My original post last week did not generate any feedback. Therefore,
> I post again in hope of reaching more audience the beginning of the
> week. The holidays are over with and the serious work begins.
>
> Victor,
>
> From: Hernandez, Victor G
> Sent: Thursday, January 12, 2017 7:46 AM
> To: 'TechNet E-Mail Forum' <[log in to unmask]<mailto:[log in to unmask]>>
> Cc: Hernandez, Victor G
> <[log in to unmask]<mailto:[log in to unmask]>>
> Subject: IPC Standard, Thermal Header Attachment Devices, THAD
>
> Fellow TechNetters:
>
> Is there any data out there regarding the integrity of a Thermal
> Header Solder Attachment/Bottom Termination Component solder joint
> integrity over time. Most BTC that I have x-rayed exhibit some
> degree of voiding. Can the solder joint voiding degrade the solder
> connector to a point that it would result in a shorted device
> internally. Is a solder joint a Thermal Insulator?
>
> Victor,
>
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