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Date: | Mon, 16 Jan 2017 21:15:02 +0000 |
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Fellow TechNetters:
My original post last week did not generate any feedback. Therefore, I post again in hope of reaching more audience the beginning of the week. The holidays are over with and the serious work begins.
Victor,
From: Hernandez, Victor G
Sent: Thursday, January 12, 2017 7:46 AM
To: 'TechNet E-Mail Forum' <[log in to unmask]<mailto:[log in to unmask]>>
Cc: Hernandez, Victor G <[log in to unmask]<mailto:[log in to unmask]>>
Subject: IPC Standard, Thermal Header Attachment Devices, THAD
Fellow TechNetters:
Is there any data out there regarding the integrity of a Thermal Header Solder Attachment joint integrity over time. Most THAD that I have x-rayed exhibit some degree of voiding. Can the solder joint voiding degrade the solder connector to a point that it would result in a shorted device internally.
Victor,
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