https://www.mentor.com/products/mechanical/flotherm/flotherm-pcb/technical-specifications

> look like very effective heat sink, that is part of the reason you have
> difficulty soldering... (few on the net will tell you insufficient ground
> soldering could occur if pre-heat is not long enough... same reason).
> IMHO.
>> Hi All,
>>
>> We have several designs in which we use the thru-hole pad and
>> surrounding
>> etch to act as a heat sink for device heat being transmitted via the
>> component leads.  Typically 2 ounce copper and often on 0.090" thick
>> FR-4
>> boards.  With the added copper thickness and larger pad area for better
>> "heat sinking" we now introduce greater difficulty in getting a quality
>> solder joint and don't get me started on the increased difficulty in
>> removing a bad component.
>>
>> So my questions are:
>> Is this a common practice?
>> Does it really provide effective device heat sinking?
>>
>> Phil Nutting  |  HVP Development Engineer   |  Excelitas Technologies
>> Corp
>>
>> Lab: +1 978.224.4332   |  Office: +1 978.224.4152
>> 35 Congress St, Salem, MA  01970 USA
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>> www.excelitas.com<http://www.excelitas.com/>
>>
>>
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>