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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 19 Dec 2016 14:57:56 +0000
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Thanks, Joyce!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, December 16, 2016 7:43 AM
To: [log in to unmask]
Subject: Re: [TN] Black Oxide issues with ENIG plating

http://ieeexplore.ieee.org/document/1645469/

> Hi Mike - the general consensus is that there is an issue with the 
> nickel plating layer. Not a ton of data in the published literature 
> but a topic that has been discussed a length in the IPC-JSTD-002/003 
> committees at times.
>
> Dave Hillman
> Rockwell Collins
>
> On Thu, Dec 15, 2016 at 7:53 PM, Lehmicke, Michael < 
> [log in to unmask]> wrote:
>
>> What is the root cause of Black Oxide issues in ENIG plating?
>>
>> Mike Lehmicke
>> Project Engineer
>> DSS Division
>> Molex, LLC-Printed Circuit Solutions
>> 22 Empire Drive
>> St. Paul, MN 55103
>> 651-846-7728
>> [log in to unmask]<mailto:[log in to unmask]>
>>
>> [cid:[log in to unmask]][cid:[log in to unmask]
>> B0]<
>> http://www.molex.com/>
>>
>>
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