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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 16 Dec 2016 08:43:19 -0500
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http://ieeexplore.ieee.org/document/1645469/

> Hi Mike - the general consensus is that there is an issue with the nickel
> plating layer. Not a ton of data in the published literature but a topic
> that has been discussed a length in the IPC-JSTD-002/003 committees at
> times.
>
> Dave Hillman
> Rockwell Collins
>
> On Thu, Dec 15, 2016 at 7:53 PM, Lehmicke, Michael <
> [log in to unmask]> wrote:
>
>> What is the root cause of Black Oxide issues in ENIG plating?
>>
>> Mike Lehmicke
>> Project Engineer
>> DSS Division
>> Molex, LLC-Printed Circuit Solutions
>> 22 Empire Drive
>> St. Paul, MN 55103
>> 651-846-7728
>> [log in to unmask]<mailto:[log in to unmask]>
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>> [cid:[log in to unmask]][cid:[log in to unmask]]<
>> http://www.molex.com/>
>>
>>
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