Question:   Too much gold, thickness, is the contributor or  hyper corrosion of the nickel layer during the immersion gold process.    One or two.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Thursday, December 15, 2016 11:04 PM
To: [log in to unmask]
Subject: Re: [TN] Black Oxide issues with ENIG plating

Too much gold is a top contributor, leading to Ni corrosion. 

Sent from my iPhone

> On Dec 15, 2016, at 11:46 PM, John Burke <[log in to unmask]> wrote:
> 
> Generally hypercorrosion of the nickel layer during the immersion gold process.
> 
> Talk to your board vendor
> 
> Best regards,
> 
> John Burke
> 
> 
>> On Dec 15, 2016, at 5:53 PM, Lehmicke, Michael <[log in to unmask]> wrote:
>> 
>> What is the root cause of Black Oxide issues in ENIG plating?
>> 
>> Mike Lehmicke
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