TECHNET Archives

December 2016

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 15 Dec 2016 20:46:19 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
Generally hypercorrosion of the nickel layer during the immersion gold process.

Talk to your board vendor

Best regards,

John Burke
 

> On Dec 15, 2016, at 5:53 PM, Lehmicke, Michael <[log in to unmask]> wrote:
> 
> What is the root cause of Black Oxide issues in ENIG plating?
> 
> Mike Lehmicke
> Project Engineer
> DSS Division
> Molex, LLC-Printed Circuit Solutions
> 22 Empire Drive
> St. Paul, MN 55103
> 651-846-7728
> [log in to unmask]<mailto:[log in to unmask]>
> 
> [cid:[log in to unmask]][cid:[log in to unmask]]<http://www.molex.com/>
> 
> 
> ________________________________
> 
> 
> 
> CONFIDENTIALITY NOTICE: This message (including any attachments) may contain Molex confidential information, protected by law. If this message is confidential, forwarding it to individuals, other than those with a need to know, without the permission of the sender, is prohibited.
> 
> This message is also intended for a specific individual. If you are not the intended recipient, you should delete this message and are hereby notified that any disclosure, copying, or distribution of this message or taking of any action based upon it, is strictly prohibited.
> 
> English | Chinese | Japanese
> www.molex.com/confidentiality.html

ATOM RSS1 RSS2