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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Wed, 14 Dec 2016 10:45:05 -0600
Content-Type:
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Hi Ioan - sorry, I don't have any information on the wire pull portion of
your task.

Dave

On Wed, Dec 14, 2016 at 10:43 AM, Ioan Tempea <
[log in to unmask]> wrote:

> Thanks Dave,
>
> I knew you guys were doing a good job in those committees!
>
> Anything on wire pull, except Dage?
>
> Best regards,
>
> Ioan
>
> De : David Hillman [mailto:[log in to unmask]]
> Envoyé : Wednesday, December 14, 2016 10:59 AM
> À : TechNet E-Mail Forum; Ioan Tempea
> Objet : Re: [TN] Mechanical test equipment for MIL-883 methods 2003 and
> 2004
>
> Hello Ioan - look in the back of the IPC JSTD 002 specification, Appendix
> E. There is solderability equipment information listed there in that
> Informative Annex.
>
> Dave Hillman
> Rockwell Collins
> IPC-JSTD-002 chairman
>
> On Wed, Dec 14, 2016 at 8:14 AM, Ioan Tempea <[log in to unmask]
> com<mailto:[log in to unmask]>> wrote:
> Dear Technos,
>
> I need to test solderability (per J-STD-002 and method 2003, test B, of
> the 883) and lead integrity (method 2004 condition D of the 883) for
> leadless components.
>
> Can you, please, suggest equipment for :
>
> *         Steam aging
>
> *         Solder bath dipping
>
> *         Wire pull; this one is for method 2004, I wonder if anybody is
> using regular wire pulling machine (normally used for wire bonds) for this
> task.
>
> Thank you,
>
> Ioan Tempea, P. Eng.
> Manufacturing Engineer, Satellite Systems
>
> [cid:[log in to unmask]]
>
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>
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