Thanks Dave,
I knew you guys were doing a good job in those committees!
Anything on wire pull, except Dage?
Best regards,
Ioan
De : David Hillman [mailto:[log in to unmask]]
Envoyé : Wednesday, December 14, 2016 10:59 AM
À : TechNet E-Mail Forum; Ioan Tempea
Objet : Re: [TN] Mechanical test equipment for MIL-883 methods 2003 and 2004
Hello Ioan - look in the back of the IPC JSTD 002 specification, Appendix E. There is solderability equipment information listed there in that Informative Annex.
Dave Hillman
Rockwell Collins
IPC-JSTD-002 chairman
On Wed, Dec 14, 2016 at 8:14 AM, Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Dear Technos,
I need to test solderability (per J-STD-002 and method 2003, test B, of the 883) and lead integrity (method 2004 condition D of the 883) for leadless components.
Can you, please, suggest equipment for :
* Steam aging
* Solder bath dipping
* Wire pull; this one is for method 2004, I wonder if anybody is using regular wire pulling machine (normally used for wire bonds) for this task.
Thank you,
Ioan Tempea, P. Eng.
Manufacturing Engineer, Satellite Systems
[cid:[log in to unmask]]
MacDonald, Dettwiler and Associates Corporation, 21025 Trans-Canada Highway, Ste-Anne-de-Bellevue, QC, Canada H9X 3R2
Tel: +1-514-457-2150 x3556<tel:%2B1-514-457-2150%20x3556>
www.mdacorporation.com<http://www.mdacorporation.com><http://www.mdacorporation.com/>
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