This is one of the few IPC 610 criteria where Keysight Technologies has an objection and includes alternate criteria in our supplemental specification.  Likely this objection is also still present in the Agilent standards.  (Maybe even HP?  Our leveraging covers several company transformations.)  Functionally, the IPC criteria doesn't protect from shorting risks.  One objection is to the definition of entrapped.  Over time (and our products are in the field for a long time), the balls could become dislodged.  Our criteria ignores whether a solder ball is entrapped and has size, quantity and reduction in conductor distance requirements.

Your basic problem is that you have work to do on solder paste selection and process optimization.  You shouldn't have that sort of spattering.