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December 2016

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DesignerCouncil <[log in to unmask]>
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Date:
Fri, 16 Dec 2016 10:40:58 -0600
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"(Designers Council Forum)" <[log in to unmask]>, Dave Schaefer <[log in to unmask]>
Subject:
Re: Plugging Thermal Via Holes with Soldermask?
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Dave Schaefer <[log in to unmask]>
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Have been specifying IPC-4761 Type VII filled and capped vias for all designs where robust thermal performance is required. I specify these on a standard signal via (0.010" drill) and use multiple vias in thermal pads to satisfy the thermal requirements of each device. As an added bonus I can use these vias in the pads of devices down to 0402 which enables an HDI design approach for products with high design density (which is basically everything I see currently). Great bang for the buck at typically 5 to 12% cost delta from a standard single plate processed PCB.

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