Your definition of "Track is broken". Perhaps you mean "external copper conductor/trace" leading to pads. Again, a photo is worth one thousand words. Send photos to this e-mail address. [log in to unmask] .
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro
Sent: Thursday, November 17, 2016 5:46 AM
To: [log in to unmask]
Subject: [TN] RES: [TN] RES: [TN] Immersion Tin - problems
Many pads
_____________________________
Juliano Bettim Ribeiro
DATACOM
+55 (51) 8446-2135
+55 (51) 3933-3000
Ramal: 3484
-----Mensagem original-----
De: Stadem, Richard D. [mailto:[log in to unmask]]
Enviada em: sexta-feira, 11 de novembro de 2016 11:40
Para: TechNet E-Mail Forum; Datacom - Juliano Ribeiro
Assunto: RE: [TN] RES: [TN] Immersion Tin - problems
One, or many?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano
Ribeiro
Sent: Friday, November 11, 2016 5:21 AM
To: [log in to unmask]
Subject: [TN] RES: [TN] Immersion Tin - problems
Damaged = "Pad disappeared" the track has broken
_____________________________
Juliano Bettim Ribeiro
DATACOM
+55 (51) 8446-2135
+55 (51) 3933-3000
Ramal: 3484
-----Mensagem original-----
De: TechNet [mailto:[log in to unmask]] Em nome de George Wenger
Enviada em: quinta-feira, 10 de novembro de 2016 17:32
Para: [log in to unmask]
Assunto: Re: [TN] Immersion Tin - problems
What do you mean by "damaged"? Do you mean solder doesn't wet the pad or is
there physical damage?
Sent from my iPhone
> On Nov 10, 2016, at 1:16 PM, Vladimir <[log in to unmask]> wrote:
>
> Hi Juliano,
>
> The board finish most probably has nothing to do with the problem. It must
be your process.
>
> Regards,
>
> Vladimir
> SENTEC
>
> Sent from my BlackBerry 10 smartphone on the Rogers network.
> Original Message
> From: Datacom - Juliano Ribeiro
> Sent: Thursday, November 10, 2016 13:13
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: [TN] Immersion Tin - problems
>
> Hello to all,
>
>
>
> We recently are changing to Lead Free process to specific products and
> we need to change the finishes boards from (HAL Tin Lead) to Immersion
Tin.
>
> But during the Selective Soldering process the component pad is damaged.
>
> Are there limitation about Immersion Tin about Max. Temperature, Max.
> Reflow/Wave process, Max Soldering Contact Time, etc.???
>
> In this case the HAL Lead Free is better?
>
>
>
>
>
> Thank you
>
> Juliano Ribeiro
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