TECHNET Archives

November 2016

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 1 Nov 2016 15:27:59 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
This is true on a PWB gold finger.   How about a connector contact pin/button?   The contact has no edges per say.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Mattix, Dwight

Sent: Tuesday, November 01, 2016 10:03 AM

To: [log in to unmask]

Subject: Re: [TN] Hard Au vs ENIG detection (was [TN] Test)



X-section will tell very quickly whether it's hard Au or ENIG.  Hard gold will have an overhang that extends out beyond the underlying etched copper.





Hard gold is indeed an electrolytic process. As such, except in a few very specialized pwb fabs, it is applied before the outer layer is etched. The unetched, solid copper outerlayer serves as the buss for the electrolytic plating.  A photoresist is applied to the outerlayer first so that the NiAu is plated on as the outerlayer circuit pattern. Then the photoresist is removed to expose the underlying copper. The panel is then etched and the NiAu pattern serves as the etch resist for the outerlayer circuit image.  As that copper is etched down to the outer layer of laminate, it also etches horizontally back under the NiAu. The result is an overhanging "cornice" of NiAu along all the etched circuit edges.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Giamis, Andy

Sent: Tuesday, November 01, 2016 7:45 AM

To: [log in to unmask]

Subject: Re: [TN] Test



Hi Victor,

The great and all-knowing Wikipedia says hard gold often contains a small amount of cobalt or nickel.  

I am also not an expert, but I believe hard gold is an electrolytic process.  Although the electrolytic process can be stopped any time, typically target thicknesses are considerably thicker (30 micro-inches or more).  If you are looking at 5 micro-inches, I'd guess it is immersion gold.  The best action is to ask the supplier.  If that's not an option, try EDS looking for cobalt.  That's no guarantee, but positive results for cobalt would be informative.  5 micro-inches would be too thin to look for nickel.  Good luck.



Did I pass the test?





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]

Sent: Tuesday, November 01, 2016 7:19 AM

To: [log in to unmask]

Subject: Re: [TN] Test



Fellow TechNetters:



   I did not receive a response the FIRST time .   therefore I pose the inquiry once again.



“Is there a test or method to determine if gold plating is hard gold or ENIG?     XRF will determine thickness of gold but will not verify plating process.   I am working with a measurement of 5 micro inches of gold.”



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman

Sent: Tuesday, November 01, 2016 7:14 AM

To: [log in to unmask]

Subject: Re: [TN] Test



I don't know about the rest of the folks but I received an A+ and its rumored  you received a C-



Dave



On Tue, Nov 1, 2016 at 7:09 AM, Douglas Pauls < [log in to unmask]> wrote:



> And what percentage of our grade is this test?

>

>

> Doug Pauls

> Principal Materials and Process Engineer Rockwell Collins

>

> On Mon, Oct 31, 2016 at 9:17 AM, Vadim Matveyev 

> <[log in to unmask]>

> wrote:

>

> > Test

> >

>


ATOM RSS1 RSS2