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November 2016

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Subject:
From:
Paul O Connor <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul O Connor <[log in to unmask]>
Date:
Tue, 15 Nov 2016 04:05:28 -0600
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I've had experience of this issue in the past.... empirical testing (thermal shock 15 sec transfer time) with multiple daisy chain samples, time to failure analysis resulted in... 
reduce hole aspect ratio
retain unused copper pads on inner layers
constrain material to low CTE type
increase copper plating in holes

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