Going back to a previous comment Richard made I too would never use immersion tin as a PCB surface finish. My preference still is immersion silver. Now to Julianos comment about a pad disappearing during selective wave soldering. I can't believe a pad disappearing has any thing to do about immersion tin surface finish or selective wave soldering parameters as much as it base to do with poor PCB fabrication. I would cross section a pad before soldering to see what the copper thickness is

Sent from my iPhone

> On Nov 11, 2016, at 8:40 AM, Stadem, Richard D. <[log in to unmask]> wrote:
> 
> One, or many?
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro
> Sent: Friday, November 11, 2016 5:21 AM
> To: [log in to unmask]
> Subject: [TN] RES: [TN] Immersion Tin - problems
> 
> Damaged = "Pad disappeared" the track has broken 
> 
> _____________________________
> Juliano Bettim Ribeiro
> DATACOM 
> +55 (51) 8446-2135
> +55 (51) 3933-3000 
> Ramal: 3484
> 
> 
> 
> -----Mensagem original-----
> De: TechNet [mailto:[log in to unmask]] Em nome de George Wenger
> Enviada em: quinta-feira, 10 de novembro de 2016 17:32
> Para: [log in to unmask]
> Assunto: Re: [TN] Immersion Tin - problems
> 
> What do you mean by "damaged"?  Do you mean solder doesn't wet the pad or is
> there physical damage?
> 
> Sent from my iPhone
> 
>> On Nov 10, 2016, at 1:16 PM, Vladimir <[log in to unmask]> wrote:
>> 
>> Hi Juliano,
>> 
>> The board finish most probably has nothing to do with the problem. It must
> be your process.
>> 
>> Regards,
>> 
>> Vladimir
>> SENTEC
>> 
>> Sent from my BlackBerry 10 smartphone on the Rogers network.
>>  Original Message
>> From: Datacom - Juliano Ribeiro
>> Sent: Thursday, November 10, 2016 13:13
>> To: [log in to unmask]
>> Reply To: TechNet E-Mail Forum
>> Subject: [TN] Immersion Tin - problems
>> 
>> Hello to all,
>> 
>> 
>> 
>> We recently are changing to Lead Free process to specific products and 
>> we need to change the finishes boards from (HAL Tin Lead) to Immersion
> Tin.
>> 
>> But during the Selective Soldering process the component pad is damaged. 
>> 
>> Are there limitation about Immersion Tin about Max. Temperature, Max.
>> Reflow/Wave process, Max Soldering Contact Time, etc.???
>> 
>> In this case the HAL Lead Free is better?
>> 
>> 
>> 
>> 
>> 
>> Thank you
>> 
>> Juliano Ribeiro