Preferred by European designers over ImAg.
One is not always given a choice.

On Thu, Nov 10, 2016 at 3:29 PM, Stadem, Richard D. <
[log in to unmask]> wrote:

> I agree with that. I would never use Immersion Tin as a final finish for
> PWBs.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer - EXT
> Sent: Thursday, November 10, 2016 12:24 PM
> To: [log in to unmask]
> Subject: Re: [TN] Immersion Tin - problems
>
> I agree with Vladimir, but from my experience, the subject line should
> have been "Immersion Tin = problems". ImAg is relatively problem free and
> much better performing. After poor storage practice, ImSn will still be
> pretty white and not take solder well, whereas ImAg can look like
> brown/purple/yellow crap and still solder fine.
>
> Wayne
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir
> Sent: Thursday, November 10, 2016 10:17 AM
> To: [log in to unmask]
> Subject: Re: [TN] Immersion Tin - problems
>
> Hi Juliano,
>
> The board finish most probably has nothing to do with the problem. It must
> be your process.
>
> Regards,
>
> Vladimir
> SENTEC
>
> Sent from my BlackBerry 10 smartphone on the Rogers network.
>   Original Message
> From: Datacom - Juliano Ribeiro
> Sent: Thursday, November 10, 2016 13:13
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: [TN] Immersion Tin - problems
>
> Hello to all,
>
>
>
> We recently are changing to Lead Free process to specific products and we
> need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.
>
> But during the Selective Soldering process the component pad is damaged.
>
> Are there limitation about Immersion Tin about Max. Temperature, Max.
> Reflow/Wave process, Max Soldering Contact Time, etc.???
>
> In this case the HAL Lead Free is better?
>
>
>
>
>
> Thank you
>
> Juliano Ribeiro
>