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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 10 Nov 2016 20:29:22 +0000
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I agree with that. I would never use Immersion Tin as a final finish for PWBs. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer - EXT
Sent: Thursday, November 10, 2016 12:24 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion Tin - problems

I agree with Vladimir, but from my experience, the subject line should have been "Immersion Tin = problems". ImAg is relatively problem free and much better performing. After poor storage practice, ImSn will still be pretty white and not take solder well, whereas ImAg can look like brown/purple/yellow crap and still solder fine.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir
Sent: Thursday, November 10, 2016 10:17 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion Tin - problems

Hi Juliano,

The board finish most probably has nothing to do with the problem. It must be your process.

Regards,

Vladimir
SENTEC

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message
From: Datacom - Juliano Ribeiro
Sent: Thursday, November 10, 2016 13:13
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Immersion Tin - problems

Hello to all,



We recently are changing to Lead Free process to specific products and we need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.

But during the Selective Soldering process the component pad is damaged. 

Are there limitation about Immersion Tin about Max. Temperature, Max.
Reflow/Wave process, Max Soldering Contact Time, etc.???

In this case the HAL Lead Free is better?





Thank you

Juliano Ribeiro

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