TECHNET Archives

November 2016

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
George Wenger <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, George Wenger <[log in to unmask]>
Date:
Thu, 10 Nov 2016 14:32:14 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (45 lines)
What do you mean by "damaged"?  Do you mean solder doesn't wet the pad or is there physical damage?

Sent from my iPhone

> On Nov 10, 2016, at 1:16 PM, Vladimir <[log in to unmask]> wrote:
> 
> Hi Juliano,
> 
> The board finish most probably has nothing to do with the problem. It must be your process.
> 
> Regards,
> 
> Vladimir
> SENTEC
> 
> Sent from my BlackBerry 10 smartphone on the Rogers network.
>   Original Message  
> From: Datacom - Juliano Ribeiro
> Sent: Thursday, November 10, 2016 13:13
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: [TN] Immersion Tin - problems
> 
> Hello to all,
> 
> 
> 
> We recently are changing to Lead Free process to specific products and we
> need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.
> 
> But during the Selective Soldering process the component pad is damaged. 
> 
> Are there limitation about Immersion Tin about Max. Temperature, Max.
> Reflow/Wave process, Max Soldering Contact Time, etc.???
> 
> In this case the HAL Lead Free is better?
> 
> 
> 
> 
> 
> Thank you
> 
> Juliano Ribeiro

ATOM RSS1 RSS2