TECHNET Archives

November 2016

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Vladimir <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir <[log in to unmask]>
Date:
Thu, 10 Nov 2016 14:22:02 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (63 lines)
Hi Ed,

I don't think the string has anything to do with the problem they see.

Regards,

Vladimir
SENTEC

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: Ed Popielarski
Sent: Thursday, November 10, 2016 13:59
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: Re: [TN] Immersion Tin - problems

http://www.circuitnet.com/experts/87578.html


Ed Popielarski
Engineering Manager


970 NE 21st Ct.
Oak Harbor, Wa. 98277

Ph: 360-675-1322
Fx: 206-624-0695
Cl: 360-544-2289



"It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design."
https://goo.gl/maps/mMjg43rXeFB2

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro
Sent: Thursday, November 10, 2016 10:12 AM
To: [log in to unmask]
Subject: [TN] Immersion Tin - problems

Hello to all,



We recently are changing to Lead Free process to specific products and we need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.

But during the Selective Soldering process the component pad is damaged. 

Are there limitation about Immersion Tin about Max. Temperature, Max.
Reflow/Wave process, Max Soldering Contact Time, etc.???

In this case the HAL Lead Free is better?





Thank you

Juliano Ribeiro

ATOM RSS1 RSS2