Those two finishes are fairly similar from a wettability perspective, assuming the ENIG is done properly and that no contamination or significant oxidation occurs.



If you are putting down some high-Au parts, such as leadless ceramic packages, then the reduction in solder volume will make joint embrittlement/stalled flow (due to AuSn being formed) more likely, so you may want to adjust stencil apertures if you have those parts.



But profile should probably be good. Might be able to reduce time above liquidus slightly to reflect the fact that with ENIG there is no oxide to strip.



Wayne



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Blair Hogg

Sent: Thursday, November 10, 2016 11:01 AM

To: [log in to unmask]

Subject: [TN] Reflow Profile using HASL or ENIG



Hi Technetters,



Would a reflow profile need to change based upon the finish of the board? If we switch from HASL to ENIG would we need to change any parameters? (I know, probably too broad of a question)



Thanks!



Blair