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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro
Sent: Thursday, November 10, 2016 10:12 AM
To: [log in to unmask]
Subject: [TN] Immersion Tin - problems

Hello to all,

 

We recently are changing to Lead Free process to specific products and we need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.

But during the Selective Soldering process the component pad is damaged. 

Are there limitation about Immersion Tin about Max. Temperature, Max.
Reflow/Wave process, Max Soldering Contact Time, etc.???

In this case the HAL Lead Free is better?

 

 

Thank you

Juliano Ribeiro