Vladimir

Probably the process is one variable about the problem but we would like to
know about the finishes boards limitation.

The specific product we have difficult to soldering in the THT components so
we needed use Heating Temp around 200°C and the contact time around
5s@320°C.
If we change the parameters the soldering is no good no fillet the hole
(<25%).

Maybe change the our products specification will be a way but we would like
to study all variables.

Thank you


_____________________________
Juliano Bettim Ribeiro
DATACOM 
+55 (51) 8446-2135
+55 (51) 3933-3000 
Ramal: 3484


-----Mensagem original-----
De: TechNet [mailto:[log in to unmask]] Em nome de Vladimir
Enviada em: quinta-feira, 10 de novembro de 2016 16:17
Para: [log in to unmask]
Assunto: Re: [TN] Immersion Tin - problems

Hi Juliano,

The board finish most probably has nothing to do with the problem. It must
be your process.

Regards,

Vladimir
SENTEC

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message
From: Datacom - Juliano Ribeiro
Sent: Thursday, November 10, 2016 13:13
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Immersion Tin - problems

Hello to all,



We recently are changing to Lead Free process to specific products and we
need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.

But during the Selective Soldering process the component pad is damaged. 

Are there limitation about Immersion Tin about Max. Temperature, Max.
Reflow/Wave process, Max Soldering Contact Time, etc.???

In this case the HAL Lead Free is better?





Thank you

Juliano Ribeiro