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Subject:
Re: Immersion Tin - problems
From:
Vladimir <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir <[log in to unmask]>
Date:
Thu, 10 Nov 2016 13:16:33 -0500
Content-Type:
text/plain
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Hi Juliano,

The board finish most probably has nothing to do with the problem. It must be your process.

Regards,

Vladimir
SENTEC

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: Datacom - Juliano Ribeiro
Sent: Thursday, November 10, 2016 13:13
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Immersion Tin - problems

Hello to all,



We recently are changing to Lead Free process to specific products and we
need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.

But during the Selective Soldering process the component pad is damaged. 

Are there limitation about Immersion Tin about Max. Temperature, Max.
Reflow/Wave process, Max Soldering Contact Time, etc.???

In this case the HAL Lead Free is better?





Thank you

Juliano Ribeiro

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