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Subject:
Immersion Tin - problems
From:
Datacom - Juliano Ribeiro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Datacom - Juliano Ribeiro <[log in to unmask]>
Date:
Thu, 10 Nov 2016 16:11:48 -0200
Content-Type:
text/plain
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text/plain (22 lines) 
Hello to all,

 

We recently are changing to Lead Free process to specific products and we
need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.

But during the Selective Soldering process the component pad is damaged. 

Are there limitation about Immersion Tin about Max. Temperature, Max.
Reflow/Wave process, Max Soldering Contact Time, etc.???

In this case the HAL Lead Free is better?

 

 

Thank you

Juliano Ribeiro

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