180° to 210° F depending on board Cu density. Higher density = higher preheat.

That's what Howard Manko used to preach.

Ed Popielarski
Engineering Manager


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nutting, Phil
Sent: Wednesday, November 02, 2016 8:21 AM
To: [log in to unmask]
Subject: [TN] tin/lead wave solder profiles

Hi all,

It has become difficult to find information related to tin/lead wave soldering.  We have a table top tin/lead wave solder system that we are having difficulty dialing in.  We are running Kester 197 flux and Kester 63/37 bar solder and producing thru-hole circuit boards for space applications.

I'm looking for typical 0.062" board parameters of top side board temperatures after fluxing and before hitting the wave.

Thanks in advance,

Phil Nutting  |  HVP Development Engineer   |  Excelitas Technologies Corp

Lab: +1 978.224.4332   |  Office: +1 978.224.4152
35 Congress St, Salem, MA  01970 USA
[log in to unmask]<mailto:[log in to unmask]>
www.excelitas.com<http://www.excelitas.com/>


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