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Fri, 11 Nov 2016 11:42:22 -0800 |
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Through via or laser drilled micro via??
Best regards,
John Burke
> On Nov 11, 2016, at 11:13 AM, Steve Golemme <[log in to unmask]> wrote:
>
> We have a couple of expensive first time build boards that failed ICT in
> assembly due to what appears to be cracked vias. Adding solder to the via
> hole seems to fix the issue.
>
> What are folks thoughts on plugging vias with solder to fix them? What
> risks are we taking by adding solder vs another technique? Could folks
> recommend alternate repair techniques that may provide better
> thermal/vibration?
>
> Also, I'd love to hear up alternate possible root causes? This problem
> screams insufficient plating during fab or thermal shock during assembly,
> but I'd like to investigate all possible failure modes. This is a
> multi-layer double sided SMT + wave rigid-flex PCB and the cracking is on
> the rigid portion.
>
> Thanks,
> Stephen Golemme
> Manufacturing Engineer, Makani
> 650-214-5647
> solveforx.com/makani
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