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Drop a wire in it when you solder it and finish off the wire on the via ring or nearby connected pad.
Without doing FA, you don't know how reliable this will be in the field unless it is simply a double sided board. In that case, the wire fix is guaranteed to make that particular interconnect, but what does the failure say about the surrounding vias? Are they just about to go?
Good Luck!
Wayne
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Golemme
Sent: Friday, November 11, 2016 11:14 AM
To: [log in to unmask]
Subject: [TN] Fixing Cracked via holes
We have a couple of expensive first time build boards that failed ICT in assembly due to what appears to be cracked vias. Adding solder to the via hole seems to fix the issue.
What are folks thoughts on plugging vias with solder to fix them? What risks are we taking by adding solder vs another technique? Could folks recommend alternate repair techniques that may provide better thermal/vibration?
Also, I'd love to hear up alternate possible root causes? This problem screams insufficient plating during fab or thermal shock during assembly, but I'd like to investigate all possible failure modes. This is a multi-layer double sided SMT + wave rigid-flex PCB and the cracking is on the rigid portion.
Thanks,
Stephen Golemme
Manufacturing Engineer, Makani
650-214-5647
solveforx.com/makani
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