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October 2016

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From:
"Giamis, Andy" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Giamis, Andy
Date:
Tue, 18 Oct 2016 13:38:28 +0000
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Hi Bob,

We use XRF for most plating thickness analysis (PCB and other plated parts).  We cross-section and verify either optically or with SEM/EDS when we can.  Most of the time, we're within about 5%.  We use several Fischer Technologies systems. 

http://www.fischer-technology.com



We've had positive experience with these tools in the NJ lab and have since implemented this tool as part of our global IQC.







-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Wettermann

Sent: Tuesday, October 18, 2016 8:29 AM

To: [log in to unmask]

Subject: [TN] Measuring Gold Thickness



Outside of x-sectional measurements for QA. can someone please share their favorite method/instrument for measuring gold thicknesses on PCBs?



Thanks



Bob/BEST


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