No. But let me clarify the intention. The intention was to prevent solder from being added to the top (or bottom) side of a component already soldered on one side.

There was also a discussion during the J-STD-001 committee meetings at the time that soldering from the opposite (source) side of the board helps to prevent overheating of the component. This is a very valid point.

To summarize; it is preferable to solder from the source side, the source side being the opposite side of the board from the component body (which has nothing to do with what is considered the source side for the rest of the components on the board). Minor touchup on the target side is OK, but you don't want to be creating large voids inside the plated through hole by soldering first one side and then the other.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski

Sent: Friday, October 14, 2016 1:01 PM

To: [log in to unmask]

Subject: Re: [TN] Solder source side



I believe your interpretation is wrong. Solder can be applied from either side regardless of which side the part is on, as long as it conforms to all other applicable specs, i.e., hole fill, annular ring coverage on source side (regardless of which side that is), etc.



Does anyone challenge that interpretation?



Ed Popielarski

Engineering Manager





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-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Edward Rios

Sent: Friday, October 14, 2016 10:12 AM

To: [log in to unmask]

Subject: Re: [TN] Solder source side



Here it is.



https://drive.google.com/file/d/0B8z9mqSojHVnVE1UVTdwQVpnSEk/preview