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From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Fri, 14 Oct 2016 15:58:01 +0000
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It is called out in the "Forward" 1.6.1.3: "...The source side may be the primary side when hand soldering operations are conducted"



Ed Popielarski

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-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Edward Rios

Sent: Friday, October 14, 2016 8:28 AM

To: [log in to unmask]

Subject: [TN] Solder source side



Hello TechNetters,



I have been reviewing the J-STD-001F WAM1 and the IPC A-610F WAM1 and have not been able to find where the text states that for a through hole component, the solder source side is the opposite of the component side (solder should be applied where the lead pokes out on the other side of the board).



I know this is kind of an obvious thing for anyone in the industry, particularly when you look at the pictures, but the actual definition in the text is vague in this respect.



To put it differently, do the standards allow for a component to be hand soldered and have the solder applied on the component side?



Thanks,



–Ed


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