Hello TechNetters,

I have been reviewing the J-STD-001F WAM1 and the IPC A-610F WAM1 and have not been able to find where the text states that for a through hole component, the solder source side is the opposite of the component side (solder should be applied where the lead pokes out on the other side of the board).

I know this is kind of an obvious thing for anyone in the industry, particularly when you look at the pictures, but the actual definition in the text is vague in this respect.

To put it differently, do the standards allow for a component to be hand soldered and have the solder applied on the component side?

Thanks,

–Ed