x-ray programs take images of areas of interest on the board. You can 
program it to cover everything, or just certain components. The x-ray 
software analyzes the components from your cad file that are in the image. 
We use two different Field of View settings which basically divide the 
area of inspection up into either 1 inch ,or 1/2 inch squares. This can be 
multiple small parts analyzed at once in a single image, or it may take 4 
images to cover a larger BGA, depending on the Field of view (which 
equates to the magnification) used in the program.



Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Canada
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x7373
[log in to unmask]
www.parker.com/ecd







From:   "Stadem, Richard D." <[log in to unmask]>
To:     <[log in to unmask]>
Date:   2016-09-20 12:06 PM
Subject:        Re: [TN] J-STD-001 Space Addendum
Sent by:        TechNet <[log in to unmask]>



Why in the world are you thinking that each termination requires an 
individual X-ray?
There is no reason for that.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Tuesday, September 20, 2016 11:33 AM
To: [log in to unmask]
Subject: Re: [TN] J-STD-001 Space Addendum

6012 for example, does have different sampling allowances at different c=0 
rates, depending on the attribute being evaluated.
Independent of the sampling rate, my original question was more 'what does 
the 001 Space Addendum require'. It says to examine hidden solder joints 
by X-Ray, not debating that, it just doesn?t state the extent. So if you 
have 300 hidden solder joints on a PWA, would 001 require you do to 300 
X-rays?.. per PWA. Thats what I was trying to gage. I should?ve also asked 
to respondents to state whether they are suppliers or users, to try to 
balance the responses in the absence of a clear direction.

Thank you all?.


> On Sep 20, 2016, at 12:20 PM, Mattix, Dwight <[log in to unmask]> 
wrote:
> 
> Tru dat. 
> 
> <runs off on tangential QE geekery>
> These days, does anybody actually apply dynamic changes to sampling 
rates based on changing levels of conformance?  E.g. the old 
Mil-Std-105(?) sampling plan standard? 
> 
> -----Original Message-----
> From: Jose A Rios [mailto:[log in to unmask]] 
> Sent: Tuesday, September 20, 2016 9:14 AM
> To: TechNet E-Mail Forum <[log in to unmask]>; Mattix, Dwight 
<[log in to unmask]>
> Subject: Re: [TN] J-STD-001 Space Addendum
> 
> What I meant is that when placing replicate devices from the same lot 
across a pwb during assembly, the cleaning, the paste screening process, 
reflow process, etc is common to that pwb, hence lending itself to 
sampling.
> 
>> On Sep 20, 2016, at 11:45 AM, Mattix, Dwight <[log in to unmask]> 
wrote:
>> 
>> Re: "...the processing of the board is the same for the entire PWA??"
>> 
>> Is that the only factor to ponder?
>> It would seem to be a first order effect to be sure. 
>> 
>> What about other inputs? E.g.
>> Variability in surface factors affecting wetting:
>> - solderable finish variance from pwb to pwb?
>> - Variability in surface cleanliness from pwb to pwb, different lots of 
pwbs
>> - variability in component lead's finish and wettability, different 
component lots
>> 
>> 
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
>> Sent: Tuesday, September 20, 2016 6:20 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] J-STD-001 Space Addendum
>> 
>> Agreed. The cost is neglible.
>> 
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
>> Sent: Monday, September 19, 2016 7:00 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] J-STD-001 Space Addendum
>> 
>> Xray every one of them.
>> 
>> Best regards,
>> 
>> John Burke
>> 
>> 
>>> On Sep 19, 2016, at 2:52 PM, Joey Rios <[log in to unmask]> wrote:
>>> 
>>> Sections 7.5.14, 15 and 16 outlines inspection of hidden solder 
joints, invoking the use of X-Ray in the Space Addendum. The standard does 
not explicitly prescribe a sampling extent, so, if an assembly has dozens 
of the same device, like 50-100 say of such devices (such as a bottom 
termination component) on a single PWA, is the expectation (J-STD intent) 
that each of the replicate devices are inspected by X-Ray?? Is that what 
the industry practices, or is sampling commonly invoked, since the 
processing of the board is the same for the entire PWA??
>