There are other issues with laser depaneling. One is that you may have to increase the minimum copper spacing to more than the standard .050" from the edges, as the laser can carbonize the FR-4, and especially the polyimide substrates. This can provide a low current leakage path. For high power applications this can increase over time and lead to catastrophic failure.



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman

Sent: Monday, September 19, 2016 3:13 PM

To: [log in to unmask]

Subject: Re: [TN] Routing



Hi John - I have seen very successful laser de-paneling but there was a limitation on board thickness. The boards needed to be more on the thin side (0.030") than the thick side (0.100"). Plus the type of laminate played a big role in success or failure of the process.



Dave Hillman

Rockwell Collins

[log in to unmask]



On Mon, Sep 19, 2016 at 1:36 PM, John Burke <[log in to unmask]> wrote:



> Hi guys,

>

> Discussion came up on removal of routing dust particularly under BGA's 

> what is best practice?

>

> Also does anyone have experience of laser de-paneling ??

>

> Best regards,

>

> John Burke

>